Bridging the gap between nanomaterials research and manufacturing.
Key integration barriers
Lack of reproducibility and process control
Manual and liquid-based transfer methods introduce high variability in nanomaterial placement and device behavior, making results difficult to reproduce and compare.
Limited scaling beyond single devices
Most integration approaches are too slow or incompatible with semiconductor workflows, preventing teams from scaling beyond isolated device demonstrations.
Material variability slows development
Heterogeneous nanomaterials and limited characterization tools lead to wasted experiments, higher costs, and long development cycles.
Solved by Chiral
Deterministic, automated integration
Chiral’s mechanical transfer system enables precise, repeatable placement of nanomaterials, delivering consistent device performance across devices and wafers.
Wafer-scale manufacturing
Chiral enables a direct path from single devices to wafer-scale integration through high-precision, automated assembly.
Intelligent selection and clean transfer
Chiral combines AI-based material selection with contamination-free mechanical transfer to integrate only device-ready nanomaterials.
From concept to scalable devices
We provide two complementary pathways to help you build the next-generation devices with nanomaterials.
Nanodevice Foundry
We develop customized processes for nanomaterial-based devices for researchers and semiconductor companies. We accelerate your development cycles by delivering high quality tailored devices, fabricated with our propriatory contamination-free technology.
Nanoassembly equipment
Our automated nanoassembly system enables low-temperature, contamination-free integration of nanomaterials into high-performance transistors and quantum devices at wafer scale. Mechanical transfer is the cleanest integration method, and Chiral turns it from a slow manual process into a fast, reliable, and scalable manufacturing step.